Manufacturing processing - Shield case production
It can be made from materials such as tinplate, copper, brass, and aluminum.
In shield case manufacturing, it is possible to produce using materials such as SPTE (tinplate), C1100P (copper), C2801P (brass), and A5052P (aluminum). The bead at the lid catch can have its length freely adjusted due to the dedicated mold's feeding process. We also manufacture cases with high shielding effectiveness that have solder applied to the corners. The solder used is Senju Metal's RoHS-compliant solder ECOSOLDER Sn-Ag-Cu 3-element alloy part number M705. 【Materials】 ○ SPTE (tinplate) ○ C1100P (copper) ○ C2801P (brass) ○ A5052P (aluminum), etc. For more details, please contact us or download the catalog.
- 企業：薄井電機製作所 玉造工場
- 価格：Other
